PCB board-level process quality evaluation Featured Image

PCB board-level process yemhando yekuongorora

Tsanangudzo Pfupi

Matambudziko emhando yemagetsi chigadzirwa process account ye80% yeiyo yese mune yakakura mota dzemagetsi vatengesi.Panguva imwecheteyo, maitiro asina kujairika maitiro anogona kukonzera kutadza kwechigadzirwa, uye kunyangwe kusajairika muhurongwa hwese, zvichikonzera kuyeuka kwebatch, zvichikonzera kurasikirwa kwakanyanya kune vanogadzira zvigadzirwa zvemagetsi, uye kuwedzera kutyisidzira kuhupenyu hwevafambi.

Neanopfuura makore gumi echiitiko mukutadza kuongorora, GRGT ine kugona kupa mota uye yemagetsi PCB board-level process yekuongorora, kusanganisira VW80000 nhevedzano, ES90000 yakatevedzana nezvimwewo, kubatsira mabhizinesi kuwana hungangoita hurema hwemhando uye kuwedzera kudzora njodzi yemhando yechigadzirwa.

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Product Detail

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Service Scope

PCB, PCBA, mota welding zvikamu

Test standards:

OEM zviyero

Korean (kusanganisira mubatanidzwa) - ES90000 akatevedzana;

Japanese (kusanganisira joint venture) - TSC0507G, TSC0509G, TSC0510G, TSC3005G series;

German (kusanganisira mubatanidzwa) - VW80000 akatevedzana;

American (kusanganisira mubatanidzwa) - GMW3172;

Greely mota dzakatevedzana zviyero;

Chery mota dzakatevedzana zviyero;

FAW mota dzakatevedzana zviyero;

Zvimwe zviyero zveindasitiri, zviyero zvenyika, zviyero zvemauto nezvimwe.:

GB/2423A

JEDEC JESD22

NSIPCI

J-STD-020

J-STD-001

J-STD-002

J-STD-003

IPC-A610

IPC-TM-650

IPC-9704

IPC-6012

IPC-6013

JISZ3198

IEC60068

Test zvinhu

Test type	Test zvinhu
Flux bvunzo zvinhu	Solid content Solderability Halogen content Surface Insulation Resistance Electromigration etc.
Solder paste bvunzo zvinhu	Chikamu saizi Viscosity Bridging Collapse Kunyorova Ndebvu dzemarata Intermetallic musanganiswa Insulation resistance Ion kutama
PCB base material test project	Kutorwa kwemvura Dielectric constant Kushingirira voltage Surface resistivity Volume resistivity
PCB bare board test project	Kuongororwa kwekuonekwa Bata kuramba Adhesion Microsection Thermal Stress Solderability Mafuta anopisa Kushingirira voltage SIR/CAF Kuchengetedza kwekushisa kwepamusoro Temperature shock Tembiricha uye mwando kusarura
PCBA soldering (lead-free process) pilot project	Microsection X-ray Kuveura simba Bond simba Kutsvaira kwenzwi Thermal Imaging Ion kusvibiswa Organic kusvibiswa Electromigration Ndebvu dzemarata Kudhaya inki tsvuku Micro strain test Kushushikana kwezvakatipoteredza senge tembiricha uye mechanical test
Yemukati uye yekunze yekushongedza bvunzo zvinhu	Coating ukobvu Bond simba Preservative Microporous / microcracked chrome Musiyano ungangoita Mimwe miedzo yekushushikana kwezvakatipoteredza
Environmental stress test project	High tembiricha basa Tembiricha kutenderera Kuchengetedza kwekushisa kwepamusoro Kuchengetedza kwakadzika kwekushisa Pressure HAST High tembiricha uye high humidity kusarura Kupisa kwepamusoro uye hunyoro hwepamusoro hunoshanda Low tembiricha basa Kumuka-kusimuka kubva kune yakaderera tembiricha 3/5/9 point basa cheki Simba tembiricha kutenderera Vibration Shock Donhedza Matatu akazara Kupfapfaidza munyu Condensation