Kuparadza Muviri Kuongorora
Nhanganyaya Yebasa
GRGT inopa inoparadza ongororo yemuviri (DPA) yezvikamu zvinofukidza passive zvikamu, discrete zvishandiso uye akasanganiswa maseketi.
Kune epamberi semiconductor maitiro, iyo DPA hunyanzvi inovhara machipisi pazasi 7nm, matambudziko anogona kuvharwa mune chaiyo chip layer kana um range;kune aerospace-level air-sealing components ine mvura mhute yekudzora zvinodiwa, iyo PPM-level yemukati yemvura mhute composition analysis inogona kuitwa kuti ive nechokwadi chekushandisa kwakakosha zvinodiwa zvemhepo-sealing components.
Service Scope
Akabatanidzwa edunhu machipisi, zvinhu zvemagetsi, discrete zvishandiso, tambo dzemagetsi, tambo uye zvinobatanidza, microprocessors, programmable logic zvishandiso, ndangariro, AD/DA, mabhazi anopindirana, general dhijitari maseketi, analog switch, analog zvishandiso, microwave Zvishandiso, magetsi, nezvimwe.
Test standards
● GJB128A-97 Semiconductor discrete device test method
● GJB360A-96 yemagetsi uye yemagetsi zvikamu zvekuedza nzira
● GJB548B-2005 Microelectronic device bvunzo nzira uye maitiro
● GJB7243-2011 Kuongorora Zveunyanzvi Zvinodiwa zveMauto Emagetsi Zvikamu.
● GJB40247A-2006 Inoparadza Physical Analysis Nzira yeMauto Electronic Components.
● QJ10003-2008 Screening Guide yeZvikamu Zvinotengeswa
● MIL-STD-750D semiconductor discrete mudziyo bvunzo nzira
● MIL-STD-883G microelectronic device bvunzo nzira uye maitiro
Test zvinhu
| Test type | Test zvinhu |
| Zvinhu zvisingaparadzi | Kuongorora kwekunze kwekuona, kuongororwa kweX-ray, PIND, kuisa chisimbiso, simba rekupedzisira, kuongorora kweacoustic microscope. |
| Chinhu chinoparadza | Laser de-capsulation, kemikari e-capsulation, yemukati gasi kuumbwa kuongororwa, yemukati yekuona kuongorora, SEM kuongorora, bonding simba, shear simba, adhesive simba, chip delamination, substrate inspection, PN junction dyeing, DB FIB, hot spots kuonekwa, leakage nzvimbo. kuona, kuona crater, ESD bvunzo |
