Parizvino, DB-FIB (Dual Beam Yakatarisana Ion Beam) inoshandiswa zvakanyanya mukutsvagisa uye kuongororwa kwechigadzirwa munzvimbo dzese dzakadai se:
Ceramic zvinhu,Polymers,Metallic zvinhu,Biological zvidzidzo,Semiconductors,Geology
Semiconductor zvinhu, organic diki molecule zvinhu, polymer zvinhu, organic/inorganic hybrid zvinhu, inorganic isiri-simbi zvinhu.
Nekukurumidza kufambira mberi kwesemiconductor zvemagetsi uye yakabatanidzwa tekinoroji tekinoroji, kuwedzera kuomarara kwechishandiso uye zvimiro zvedunhu kwasimudza zvinodikanwa zvemicroelectronic chip process diagnostics, kutadza kuongorora, uye micro/nano kugadzirwa.Iyo Dual Beam FIB-SEM system, ine simba rayo rekuita machining uye kugona kwekuongorora zvidiki, zvave zvakakosha mukugadzira nekugadzira diki.
Iyo Dual Beam FIB-SEM systeminobatanidza zvose zviri zviviri Focused Ion Beam (FIB) uye Scanning Electron Microscope (SEM). Inogonesa kuona-chaiyo-nguva SEM yekutarisa kweFIB-yakavakirwa micromachining maitirwo, kusanganisa yakakwirira nzvimbo yekugadzirisa kweyerekitironi danda nehunyanzvi hwekugadzirisa zvinhu hweiyo ion beam.
Site-Specific Cross-Section Preparation
TEM Sample Imaging uye Analysis
Selective Etching kana Enhanced Etching Inspection
Metal uye Insulating Layer Deposition Testing