AQG324 Power Device Certification
Nhanganyaya Yebasa
Iyo ECPE Working Group AQG 324 yakavambwa muna Chikumi 2017 iri kushanda paEuropean Qualification Guideline yeSimba Modules Yekushandisa muPower Electronics Converter Units muMotokari.
Zvichienderana neyaimbova yeGerman LV 324 ('Kufanirwa kweMagetsi eMagetsi eMamodule eKushandiswa muMotokari Zvikamu - Zvinodiwa Zvakawanda, Mamiriro Ekuedza uye Miedzo') iyo ECPE Nhungamiro inotsanangura maitiro akajairwa ekuisa maitiro ekuongororwa kwemodule pamwe nekuyedzwa kwezvakatipoteredza uye kwehupenyu hwese. magetsi emagetsi modules yemotokari application.
Nhungamiro iyi yakaburitswa neBasa rinoshanda reIndasitiri Working Group rinosanganisira makambani ari nhengo dzeECPE ane vamiriri veindasitiri vanopfuura makumi matatu kubva kumotokari dzekutengesa.
Iyo yazvino AQG 324 vhezheni yemusi wa12 Kubvumbi 2018 inotarisa paSi-based power modules apo shanduro dzemangwana dzichaburitswa neBato Rekushanda dzichavharawo itsva wide bandgap power semiconductors SiC neGaN.
Nekududzira zvakadzama AQG324 uye zviyero zvine hukama kubva kuchikwata chenyanzvi, GRGT yakamisa hunyanzvi hwekugona kwemagetsi module, ichipa ane chiremera chekuongorora kweAQG324 uye mishumo yekusimbisa yemabhizinesi ari kumusoro-uye pasi-kuyerera muindasitiri yemagetsi semiconductor.
Service Scope
Simba mudziyo modules uye yakaenzana yakakosha dhizaini zvigadzirwa zvinoenderana ne discrete zvishandiso
Test standards
● DINENISO/IEC17025: General Zvinodiwa Zvekugona Kuedza uye Calibration Laboratories.
● IEC 60747: Semiconductor Devices, Discrete Devices
● IEC 60749: Semiconductor Zvishandiso - Mechanical uye Climatic Test Methods
● DIN EN 60664: Insulation Coordination yeZvishandiso mukati meLow-Voltage Systems.
● DINEN60069: Kuedzwa Kwezvakatipoteredza
● JESD22-A119: 2009: Yakaderera Tembiricha Yekuchengetedza Hupenyu
Test zvinhu
| Test type | Test zvinhu |
| Kuonekwa kwemodule | Static parameters, dynamic parameters, yekubatanidza layer yekuona (SAM), IPI/VI, OMA |
| Module hunhu bvunzo | Parasitic rakarasika inductance, kupisa kwemafuta, kupfupika kwedunhu kumira, bvunzo yekudzivirira, mechanical parameter yekuona. |
| Environmental test | Thermal shock, mechanical vibration, mechanical shock |
| Muedzo wehupenyu | Simba bhasikoro (PCsec, PCmin), HTRB, HV-H3TRB, dynamic gedhi bias, dynamic reverse bias, dynamic H3TRB, body diode bipolar degradation. |
